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| 05131 SFC05-4 FLIP CHIP ARRAY APPLICATIONS Cellular Phones Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 61000-4-5 (Surge): 24A, 8/20s - Level 2(Line-Gnd) & Level 3(Line-Line) QUAD FEATURES ESD Protection > 25 kilovolts 300 Watts Peak Pulse Power per Line (tp = 8/20s) Protects up to Four (4) Unidirectional Lines RoHS Compliant MECHANICAL CHARACTERISTICS Quad Flip Chip Package Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Consult Factory for Leaded Device Availability Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Top Contacts: Solder Bump 0.004" in Height (Nominal) PIN CONFIGURATION 6 5 4 1 2 BOTTOM VIEW 3 05131.R7 3/07 1 www.protekdevices.com SFC05-4 DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TA TSTG VALUE 300 -55 to 150 -55 to 150 UNITS Watts C C ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 5A VC VOLTS 9.5 @ 25C Unless Otherwise Specified MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE VWM VOLTS SFC05-4 5.0 @ 1mA V(BR) VOLTS 6.0 @8/20s VC @ IPP 11.0V @ 24A @VWM ID A 10 @0V, 1 MHz Cj pF 150 FIGURE 1 PEAK PULSE POWER VS PULSE TIME 10,000 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 120 100 80 60 40 20 0 tf FIGURE 2 PULSE WAVE FORM Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s 1,000 300W, 8/20s Waveform e-t 100 td = t I /2 PP 10 0.01 1 10 100 td - Pulse Duration - s 1,000 10,000 0 5 10 15 t - Time - s 20 25 30 05131.R7 3/07 2 www.protekdevices.com SFC05-4 GRAPHS FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20s 100 80 % Of Rated Power 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) 14 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 15 20 05131.R7 3/07 3 www.protekdevices.com SFC05-4 APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - C Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down 05131.R7 3/07 4 www.protekdevices.com SFC05-4 QUAD PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE DIM A B C B SIDE A PACKAGE DIMENSIONS MILLIMETERS 0.510 0.510 0.99 0.0254 0.15 NOM 1.5 0.0254 0.15 NOM See Note 3 0.076 MIN I 0.419 NOM INCHES 0.020 0.020 0.039 0.001 0.066 NOM 0.059 0.001 0.006 NOM See Note 3 0.003 MIN 0.0165 NOM E TOP C F G H G E F H NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. "H" Dimensions for the SFC05-4 device are from 0.10mm Max and 0.004" Max. END I MOUNTING PAD LAYOUT - Option 1 DIM A A B C D E F G PAD DIMENSIONS MILLIMETERS 0.305 0.457 0.203 0.254 0.510 0.990 0.510 INCHES 0.012 0.018 0.008 0.010 0.020 0.039 0.020 DIE SOLDER BUMPS C NOTE: 1. Preferred: Using 0.1mm (0.004") stencil. F E B G SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK 05131.R7 3/07 5 D www.protekdevices.com SFC05-4 QUAD PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LAYOUT - Option 2 DIM A B A COPPER CONTACTS 0.009" [0.23] DIA. PACKAGE DIMENSIONS MILLIMETERS 1.499 0.152 NOM 0.510 0.990 0.510 INCHES 0.059 0.006 NOM 0.020 0.039 0.020 C D E DIE SOLDER BUMPS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. D C TAPE & REEL ORIENTATION E B 1 2 6 5 4 SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK 3 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA 481. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-, i.e., SFC05-4-T75-1. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., SFC05-4-T75-2. Suffix - LF = Lead-Free, i.e., SFC05-4-LF-T75-2. Outline & Dimensions: Rev 1 - 11/01, 06039 COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05131.R7 3/07 6 www.protekdevices.com |
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